Description
Global and China IC Advanced Packaging Industry Report, 2013-2014 is mainly all about the followings
1. Overview of semiconductor industry
2. Status quo of memory and wafer foundry industry
3. Upstream market of semiconductor industry
4. Trend in emerging advanced packaging technologies
5. Analysis and ranking of packaging enterprises
6. 23 major advanced packaging vendors
View Full Report At: http://www.marketresearchreports.biz/analysis/217376
Typically, an independent packaging and testing vendor is known as OSAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, in sharp contrast to the market size of USD23.6 billion in 2011, a figure that occupied 30% of the semiconductor industry. During 2011-2013, the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years, which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized, thus leading to a dramatic decline in unit prices, these packaging technologies including FC-BGA, WLCSP, QFN, SiP, and PoP, etc.
At present, both mobile phones and computers are developing towards ultra-thin, multi-core and high frequency while memory industry is targeted at ultra bandwidth, which would prompt the packaging and testing market to satisfy the market demand with the updated technologies. Since 2014, a number of new technologies have been applied, which would bring with it a more than 6% growth in packaging and testing industry. These technologies, including MLP PoP, Cu Bol, FC-CSP, FOWLP, Embedded Component (Trace) Substrate, and 2.5D, are mainly used in smartphones and ultra-thin computers, with a robust market demand. Meanwhile, TSV is expected to be widely applied from the memory industry. On the other hand, some major IDM vendors like Panasonic and Renesas Electronics have retreated from packaging business. It is projected that in 2014 the output value of OSAT industry will grow by 8.4% to USD27.2 billion, and advanced packaging industry probably by 10% to USD18.2 billion.
Download Sample Of This Report: http://www.marketresearchreports.biz/sample/sample/217376
In terms of industry, a type of middle-end enterprises has emerged between Foundry or IDM and OSAT since 2008. In the era of FC packaging, these enterprises mainly provide RDL, Wafer Bumping, and Wafer Level Test. But in the age of 2.5D and 3D, their scope of business has been greatly expanded, primarily including Micro Bumping, Thin & Reveal, Interposer, Via Middle, WL-Carrier Assembly, etc.
In 2014, the biggest event that happened to the packaging industry was nothing but the attempt of Temasek to sell STATS ChipPAC, the world's fifth largest packaging company. Owned by the Government of Singapore, STATS ChipPAC is less competitive, especially when facing the competition from the Taiwanese rivals. Although it has state-of-the-art technologies, yet the company depends heavily on its key accounts, including Infineon, Apple Inc., Qualcomm, and Broadcom, etc. However, Infineon has gradually withdrawn from mobile phone market while Apple Inc. and Qualcomm have diversified supply chain risks, cutting down on the orders of STATS ChipPAC, which led to a fall in revenue for four consecutive years.
In addition, a second major event was the fact that SPIL had won massive orders from Qualcomm, MTK as well as Huawei’s Hisilicon, which would considerably increase SPIL’s revenue. In H1 2014, SPIL harvested a substantial growth of 27% in revenue, making it the world’s No.1 by operating margin. In 2014, the company is expected to surpass Amkor as the global second.
Table of Content
1. Global Semiconductor Industry
1.1 Overview
1.2 Supply Chain
1.3 Semiconductor Packaging Introduction
2. Upstream & Downstream of IC Packaging Industry
2.1 Semiconductor Industry by Location
2.2 Semiconductor Industry Capital Spending Trend
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Vendors
2.3.3 Market Share of Mobile DRAM Vendors
2.4 NAND Flash
2.5 Wafer Foundry Industry
2.6 Wafer Foundry Competition
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About Us
MarketResearchReports.biz is the most comprehensive collection of market research reports. MarketResearchReports.Biz services are specially designed to save time and money for our clients. We are a one stop solution for all your research needs, our main offerings are syndicated research reports, custom research, subscription access and consulting services. We serve all sizes and types of companies spanning across various industries.
Contact Us
Office: State Tower
90 Sate Street, Suite 700
Albany, NY 12207
United States
Tel: +1-518-618-1030
USA: Canada Toll Free: 866-997-4948
Website: http://www.marketresearchreports.biz/
mailto:sales@marketresearchreports.biz
Global and China IC Advanced Packaging Industry Report, 2013-2014 is mainly all about the followings
1. Overview of semiconductor industry
2. Status quo of memory and wafer foundry industry
3. Upstream market of semiconductor industry
4. Trend in emerging advanced packaging technologies
5. Analysis and ranking of packaging enterprises
6. 23 major advanced packaging vendors
View Full Report At: http://www.marketresearchreports.biz/analysis/217376
Typically, an independent packaging and testing vendor is known as OSAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, in sharp contrast to the market size of USD23.6 billion in 2011, a figure that occupied 30% of the semiconductor industry. During 2011-2013, the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years, which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized, thus leading to a dramatic decline in unit prices, these packaging technologies including FC-BGA, WLCSP, QFN, SiP, and PoP, etc.
At present, both mobile phones and computers are developing towards ultra-thin, multi-core and high frequency while memory industry is targeted at ultra bandwidth, which would prompt the packaging and testing market to satisfy the market demand with the updated technologies. Since 2014, a number of new technologies have been applied, which would bring with it a more than 6% growth in packaging and testing industry. These technologies, including MLP PoP, Cu Bol, FC-CSP, FOWLP, Embedded Component (Trace) Substrate, and 2.5D, are mainly used in smartphones and ultra-thin computers, with a robust market demand. Meanwhile, TSV is expected to be widely applied from the memory industry. On the other hand, some major IDM vendors like Panasonic and Renesas Electronics have retreated from packaging business. It is projected that in 2014 the output value of OSAT industry will grow by 8.4% to USD27.2 billion, and advanced packaging industry probably by 10% to USD18.2 billion.
Download Sample Of This Report: http://www.marketresearchreports.biz/sample/sample/217376
In terms of industry, a type of middle-end enterprises has emerged between Foundry or IDM and OSAT since 2008. In the era of FC packaging, these enterprises mainly provide RDL, Wafer Bumping, and Wafer Level Test. But in the age of 2.5D and 3D, their scope of business has been greatly expanded, primarily including Micro Bumping, Thin & Reveal, Interposer, Via Middle, WL-Carrier Assembly, etc.
In 2014, the biggest event that happened to the packaging industry was nothing but the attempt of Temasek to sell STATS ChipPAC, the world's fifth largest packaging company. Owned by the Government of Singapore, STATS ChipPAC is less competitive, especially when facing the competition from the Taiwanese rivals. Although it has state-of-the-art technologies, yet the company depends heavily on its key accounts, including Infineon, Apple Inc., Qualcomm, and Broadcom, etc. However, Infineon has gradually withdrawn from mobile phone market while Apple Inc. and Qualcomm have diversified supply chain risks, cutting down on the orders of STATS ChipPAC, which led to a fall in revenue for four consecutive years.
In addition, a second major event was the fact that SPIL had won massive orders from Qualcomm, MTK as well as Huawei’s Hisilicon, which would considerably increase SPIL’s revenue. In H1 2014, SPIL harvested a substantial growth of 27% in revenue, making it the world’s No.1 by operating margin. In 2014, the company is expected to surpass Amkor as the global second.
Table of Content
1. Global Semiconductor Industry
1.1 Overview
1.2 Supply Chain
1.3 Semiconductor Packaging Introduction
2. Upstream & Downstream of IC Packaging Industry
2.1 Semiconductor Industry by Location
2.2 Semiconductor Industry Capital Spending Trend
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Vendors
2.3.3 Market Share of Mobile DRAM Vendors
2.4 NAND Flash
2.5 Wafer Foundry Industry
2.6 Wafer Foundry Competition
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View Full Report At: http://www.marketresearchreports.biz/analysis/232965
The conductive ink and paste business is a large market that will generate $2.2 billion in 2015 in revenue at the ink/paste level. This market however is segmented, consisting of many emerging and mature markets. Overall, the market will experience 2.7% CAGR over the coming decade.
Download Sample Of This Report: http://www.marketresearchreports.biz/sample/sample/232965
The photovoltaic sector is a large target market for conductive paste. It however underwent a period of distress characterised by tumbling prices, bankruptcies and consolidation. This was triggered by the rapid expansion of production capacity in China and the simultaneous reduction of subsidies in Europe.
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As consumer voice and data services revenues reach their saturation point, wireless carriers are keen to capitalize on other avenues to drive revenue growth. One such opportunity is providing network connectivity for M2M (Machine to Machine) devices like smart meters, connected cars, healthcare monitors and digital signage.
Download Sample Of This Report: http://www.marketresearchreports.biz/sample/sample/232543
This report package provides an in-depth assessment of M2M and wearable technology, including key market drivers, challenges, investment potential, consumer & vertical market opportunities, use cases, future roadmap, value chain, deployment case studies, ecosystem player profiles and strategic recommendations.
About Us
MarketResearchReports.biz is the most comprehensive collection of market research reports. MarketResearchReports.Biz services are specially designed to save time and money for our clients. We are a one stop solution for all your research needs, our main offerings are syndicated research reports, custom research, subscription access and consulting services. We serve all sizes and types of companies spanning across various industries.
Contact Us
Office: State Tower
90 Sate Street, Suite 700
Albany, NY 12207
United States
Tel: +1-518-618-1030
USA: Canada Toll Free: 866-997-4948
Website: http://www.marketresearchreports.biz/
mailto:sales@marketresearchreports.biz
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